Thermal Grizzly Minus Pad 8 High-Performance Thermal Pad

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad designed to provide exceptional heat conductivity for your devices. Its premium material ensures efficient heat dissipation, helping to keep your components cool and running smoothly. Easy to install and durable, it supports reliable thermal management for improved performance and device stability.

General Information

• Brand Name: Thermal Grizzly
• Model: Minus Pad 8

Material & Composition

• Material Composition: Ceramic silicon formula complex with nano aluminum oxide
• Silicon Content: Yes

Thermal Properties

• Thermal Conductivity: 8.0 W/m·K
• Thermal Resistance: 0.625 K/W
• Operating Temperature Range: −100°C to 250°C (−148°F to 482°F)

Color

• Red-Brown

Form Factor

• Flake

Available Sizes (L × W × Thickness)

• 30 × 30 × 0.5 mm (1.18 × 1.18 × 0.02 in)
• 30 × 30 × 1.0 mm (1.18 × 1.18 × 0.04 in)
• 30 × 30 × 1.5 mm (1.18 × 1.18 × 0.06 in)
• 30 × 30 × 2.0 mm (1.18 × 1.18 × 0.08 in)
• 20 × 120 × 0.5 mm (0.79 × 4.72 × 0.02 in)
• 20 × 120 × 1.0 mm (0.79 × 4.72 × 0.04 in)
• 20 × 120 × 1.5 mm (0.79 × 4.72 × 0.06 in)
• 20 × 120 × 2.0 mm (0.79 × 4.72 × 0.08 in)
• 20 × 120 × 3.0 mm (0.79 × 4.72 × 0.12 in)
• 100 × 100 × 0.5 mm (3.94 × 3.94 × 0.02 in)
• 100 × 100 × 1.0 mm (3.94 × 3.94 × 0.04 in)
• 100 × 100 × 1.5 mm (3.94 × 3.94 × 0.06 in)
• 100 × 100 × 2.0 mm (3.94 × 3.94 × 0.08 in)

Installation & Use

• Attachment Method: Self-adhesive; light pressure ensures optimal attachment
• Scope of Application: M.2 modules, GPU memory, motherboard North/South Bridge, notebook cooling, thermal pads, ICs, heat dissipation sheets, overclocking setups
• Overclocking Index: Suitable for high-performance overclocking